Thin PCB Capability

How We Define Ultra Thin PCB?

The printed circuit board substrate thickness less than 0.3mm using rigid PCB Laminate.

SEEK TECH is one of the top pc board suppliers located in China has been developing and manufacturing Ultra Thin PCB since 2018, and we have a separate ultra-thin PCB production line, which is the key to making seek tech unique, and it is also the main product manufactured by Seek Tech at present.

Our ultra-thin PCB technology integrates FPC, HDI, and many complex PCB processes, providing customers with unlimited design possibilities, we can make the PCB thickness less than 0.1mm, and it is also available for multilayer pcbs, like 4 layers to 10 layers. The super thin PCBs we manufacture are widely used in medical, semiconductor packaging, encryption cards and other fields.

At the same time, seek tech also has the ability to assemble ultra-thin PCBs, and our SMT line is capable of batch processing 0.1mm thick PCBs and FPCs, and can place components as little as 01035 and 01005.

Seek tech provides a one-stop PCB solution, and our technology accumulation can play an important role in the product design process, reducing unnecessary errors, thereby reducing time, reducing costs, and making products more competitive, which is why customers trust us.

If you have any questions about PCB and Assembly, kindly let us know freely.

Advantages Of Ultra Thin PCB

Disadvantages Of Ultra Thin PCB

Lightweight and thin: suitable for some products with strict volume and space requirements, generally become the composition of the product in the way of embedding.

Miniaturization: Because the material is relatively thin, ultra thin PCB is easier to process into small dimensions.

Precision: IC Substrate is also a kind of ultra thin PCB, the circuit can reach 25um or even to the minimum 15um

Easy to bend: Due to the lack of rigid support of the material, it is easy to bend during PCB manufacturing and PCB assembly, resulting in scrap

The cost is higher: The whole process of customized production line production, and due to the difficulty of the production process, the cost is generally more than 1 times higher than that of ordinary PCB

Check Our Ultra Thin Circuit Board Capability

If you need more detailed process capabilities, please contact us

Key Features	Manufacturing Capability	Remark
Material/Laminate	FR4, Halogen Free, BT(TG>200, Low CTE)
Layer Count	1-10L
Thickness/Tolerance	1L：Min 0.05mm (+/-0.01mm)	With Copper & Solder Mask
	2L：Min 0.09mm (+/-0.02mm)
	4L：Min 0.25mm (+/-0.02mm)
	6L：Min 0.4mm (+/-0.03mm)
	8L：Min 0.55mm (+/-0.05mm)
	10L：Min 0.65mm (+/-0.05mm)
Copper	Inner: T – 3OZ	T = 1/3OZ
	Outer: 1 – 3OZ
	Asymmetrical Copper	inconsistent copper thickness on both sides
Circuit Width/Space	Min 15um/15um	Coper Thickness 15um
BGA Pad	Min 0.15mm
Mechanical Via	Min 0.1mm
Laser Via	Min 0.05mm
HDI	4+N+4 / Anylayer
Solder Mask	Liquid / Dry Film	Solder Mask Level With Copper
Via Plug	Copper Fill，Resin Plug，POFV，Ink，Coper Paste Plug，Copper Bar Insertion
Surface Treatment	Surface Mount: OSP，Immersion Gold, Immersion Tin，Immersion Silver Wire/Die Bonding: Electroplated soft gold，Electroplated Silver，Electroplated Silver Gold, ENEPIG Touch: Electroplated Hard gold

The thinner, the stronger & powerful

Application of Thin PCB

Ultra-thin rigid PCBs—usually no thicker than 0.2mm, made with materials like FR-4 or rigid metal substrates—are real workhorses in tight spaces where stability can’t be compromised. Their strength, flatness, and ability to handle precise wiring make them irreplaceable in spots where every millimeter counts but you still need a solid, reliable board.

Smart Wearable Devices

Such as the mainboards of smart watches and control modules of Bluetooth headsets, ultra-thin rigid PCBs can integrate chips, sensors, and radio frequency circuits in a space of less than 0.5cm³ while maintaining impact resistance (achieved through glass fiber reinforced FR-4 substrates). For example, the PCB of some high-end smart watches is only 0.15mm thick, which can fit the curved inner wall of the watch dial without affecting the battery life space.

Camera Modules

In the lens modules of mobile phone front cameras and driving recorders, ultra-thin rigid PCBs are used to carry image sensors (CMOS) and signal processing chips. Their thickness of 0.1-0.18mm can reduce the overall volume of the lens module, ensuring that the imaging light path is not interfered by the circuit thickness and improving image quality accuracy.

Minimally Invasive Surgical Instruments

For example, the end control circuit of a laparoscope, ultra-thin rigid PCBs need to realize motor drive and sensor signal transmission inside the instrument rod with a diameter of 5-10mm. The characteristic of thickness ≤0.12mm enables it to fit closely with the mechanical structure without affecting the flexible rotation of the instrument, and at the same time, it can withstand high-temperature sterilization (the substrate is made of FR-4 resistant to 134℃ high temperature).

Portable Diagnostic Equipment

The internal mainboards of blood glucose detectors and ECG monitors, ultra-thin rigid PCBs can reduce the thickness of the equipment to less than 1cm. At the same time, through high-density wiring (line width/line spacing ≤50μm), more detection modules can be integrated, increasing the types of parameters for a single detection.

Precision Sensor Modules

Security-sensitive devices

Ultra-thin rigid PCBs, with their exceptional thinness (typically 0.1-0.15mm) and rigid structural stability, play a crucial role in security-sensitive devices like security cards, credit cards, and bank keys, where miniaturization, anti-tampering, and reliable data transmission are paramount.

IC Substrate PCB - SEEK TECH

IC Substrate PCB, a flagship product of SEEK TECH in ultra-thin PCB manufacturing, offers remarkable advantages.

Firstly, it features high precision, with ultra-fine line widths and pitches. This allows for more complex circuit designs and higher integration levels, meeting the demands of advanced semiconductor packaging. For instance, it can achieve line widths and pitches down to a few micrometers, far beyond the capabilities of regular PCBs.

Secondly, SEEK TECH’s IC Substrate PCB excels in thermal management. Its specialized materials and design enable efficient heat dissipation, crucial for high-performance chips that generate significant heat. This ensures stable operation of the chips even under high-load conditions. Moreover, it has excellent electrical performance, including low signal transmission loss and high impedance control accuracy. This guarantees reliable and fast signal transfer, which is essential for applications like high-speed data processing and communication. With these outstanding features, SEEK TECH’s IC Substrate PCB stands out in the market, providing top-notch solutions for various high-tech industries.

Supporting Subheading

The Difference Between Thin PCB & Flexible PCB Substrate

Comparison Criteria	Ultra-Thin Rigid PCB	FPC (Flexible PCB Substrate)
Substrate & Rigidity	Uses ultra-thin rigid substrates (e.g., 0.1-0.3mm FR-4), maintains rigidity, cannot bend or fold, tolerates minimal mechanical stress	Utilizes flexible substrates (e.g., PI, PET film), excellent flexibility, can bend, fold, twist freely, suitable for dynamic flexing (e.g., repeated folding)
Thickness Range	0.1-0.3mm, difficult to reduce further due to rigidity constraints	0.05-0.2mm, enables extreme thinness with thin substrates and copper foils
Structural Characteristics	Primarily single or few layers, medium wiring density, relies on substrate for circuit support	Allows multi-layer stacking with thin copper foils (≤12μm) for high-density wiring, requires local stiffeners (e.g., steel sheets) for connectors
Mechanical Performance	Poor bending resistance (risk of substrate cracking and trace breakage); better impact resistance	Exceptional flex life (tens to millions of dynamic bends); weaker tensile and impact resistance, avoid sharp pulling
Heat Dissipation & Temperature Resistance	Rigid substrates (e.g., FR-4) offer better heat dissipation, high temp resistance (typically ≥130°C)	Flexible substrates have lower thermal conductivity, limited high-temp tolerance (long-term use ≤100°C), but better low-temp and moisture resistance
Typical Applications	Credit cards, security tokens, micro sensors (medical probes), ultra-thin camera modules (static miniaturized devices)	Foldable phone hinges, laptop flex cables, smartwatch bands, automotive dashboard harnesses (dynamic or space-constrained scenarios)
Cost Level	Higher than standard rigid PCBs (due to thin substrate processing challenges), but lower than comparable FPCs	Significantly higher cost (flexible substrates, coverlay, and stiffening processes add expense)
Core Advantages	Achieves rigid support in minimal thickness, ideal for static miniaturized applications	Adapts to dynamic flexing and complex geometries, perfect for space-constrained or repeatedly bent environments

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Why Seek Tech

Professional

We have rich PCB & PCBA experience, so the purposes and needs of the PCB design are easily reconiged by us

Service

Professional team docks with customer projects to make communication smooth and clear

Quality

Strict quality management system, complete quality testing equipment

Fast

Mature fast delivery mechanism, not only fast, but also reliable.