IC Substrate Capability

IC Substrate Manufacturers - Seek Tech

IC substrate definition

The carrier for wafers in semiconductor packaging.

An IC substrate is like a tiny, high – tech bridge. It connects a semiconductor chip to its outer world, carrying electrical signals between them. Made with precise circuits, it supports the chip physically too. Think of it as the chip’s reliable sidekick, making sure data flows smoothly in devices from phones to complex electronics.

In search of IC substrate manufacturers that understand your needs? Let us be clear: what you require is a provider delivering results, fostering collaboration, and demonstrating expertise. That is exactly what Seek Tech offers.

Technically, we uphold stringent standards. We operate two independent production lines—tenting and MSAP—specialized in mid to high-end IC substrate manufacturing. This setup ensures flexibility, efficiency, and consistent quality. Our long-term partnership with Mitsubishi MGC guarantees a stable inventory of their BT materials, eliminating supply-related delays.

In terms of precision, our lines achieve a 15um minimum line width. We also have in-house electroplating facilities for soft gold and nickel-palladium-gold, allowing full control over the manufacturing process and ensuring reliable, quality outcomes.

Technical proficiency is only part of our offering. Unlike suppliers that treat collaboration as a burden, we prioritize effective communication. Whether you need clarification on IC substrate definition or modifications to IC package substrate designs, we avoid jargon, maintain professionalism, and commit to collaborative problem-solving.

Facing excessive lead times for samples? We address this proactively. Dissatisfied with suppliers failing to meet collaboration expectations? We strive to exceed them, as your success is inherently linked to ours.

Why settle for less capable alternatives? Let us ensure your IC substrate projects proceed smoothly, efficiently, and without complications. We encourage you to contact us to discuss further.

Check Our IC Substrate Capability

If you need more detailed design rule of IC Subtrate, please contact us

Thickness Design Rule

Indicating the material thickness capability we can achieve.

Showing the finished thickness we can manage for 2 to 4 layer IC Subtrate, it is very critical to the IC substrate packaging.

Total Thickness

Surface Finishing

Most common surface finishing of IC substrate and the thickness.

The Diameter and the spacing of the mechanical hole.

2Layer ICS Via Design Rule

2L ic package substrate Blind Via

Laser via is more efficient for 2L through hole process, but the thickness of the dielectric layer should be less than 0.15mm.

The Diameter and the spacing of the mechanical hole of 4Layer ICS.

4Layer ICS Via Design Rule

IC Substrate Trace design rule

We have MSAP process that can achieve 15um trace.

BGA Diameter, BGA pitch and solder mask opening.

IC Substrate BGA Design Rule

Design Rule For BusLess

No plating lead design gold plating technology, etch back invovled.

Dimension, position and slot tolernace of IC substrate, require very high precision.

IC Substrate Tolerance

IC subtrate bond finger design rule

Bond finger is use for bonding of substrate ic.

IC substrate manufacturing process in Seek Tech

When it comes to IC substrate manufacturing, Seek Tech stands out with its robust production capabilities. It boasts two independent production lines, dedicated to IC substrate manufacturing using tenting and MSAP processes respectively.

Tenting

So what is tenting process?

Tenting is an IC substrate manufacturing process where dry film is applied to cover and protect vias during plating. It is also a very typical PCB production process.

Tenting Pros & Cons

Pros:
Lower material costs due to simpler film usage; ideal for designs with larger line widths (25um+); quicker setup with shorter pre-production timelines, with faster delivery.

Cons:
Precision lags for fine lines below 25um; higher chance of voids in vias if film adhesion is uneven; less reliable for high-density, complex substrates. Best for low-to-mid complexity IC substrates where cost and speed matter more than precision.

MSAP

MSAP Defination?

MSAP, short for Modified Semi-Additive Process, is a precision-focused method in IC substrate manufacturing.
It builds circuits by plating metal onto a substrate, using advanced photoresist techniques to define fine patterns before etching. This controlled approach allows for highly detailed circuit creation.

Why MSAP？

When IC substrates demand ultra-fine lines (below 25um) and high-density designs—common in advanced electronics—
MSAP steps in. Traditional methods struggle with such precision, making MSAP essential for high-end applications where signal accuracy and component miniaturization are critical.

MSAP Pro & Cons

Pros: Exceptional precision, handling lines as thin as 15um; superior via reliability with fewer voids; ideal for complex, high-density substrates.
Cons: Higher costs due to specialized materials and processes; longer production timelines from intricate setup; greater complexity in operation, requiring skilled technicians.

Check Out Our IC package substrate Works

BGA Substrate

A BGA substrate is a type of packaging material used in BGA packaging. It connects the chip to the circuit board through solder balls arranged at the bottom. Its basic structure is composed of multiple layers of conductive materials laminated between insulating layers, usually made of materials such as BT resin or ABF. It can route electrical signals from the I/O points of the IC to the solder balls, enabling high - speed data transfer. It has the advantages of high I/O density, good thermal performance, and high reliability.

CSP Substrate

CSP stands for Chip Scale Package. A CSP substrate is a key component in chip - scale packaging technology. It is the substrate on which the chip is mounted within the CSP. It has the functions of providing electrical connections, mechanical support, and heat management for the chip. With a compact size, it can optimize space utilization, reduce assembly complexity, and is suitable for portable electronics, IoT devices, and other fields where size and weight are critical.

Flip Chip Substrate

A flip chip substrate is a small - sized PCB inside the flip chip package, which is similar to an ordinary PCB. The flip chip is connected to the substrate through solder bumps. The substrate provides electrical connection channels for the flip chip, and is usually made of materials such as laminates, build up materials, and ceramics. Its size, number of layers, and material properties directly affect the overall cost of the package. The design of the substrate needs to consider the layout of signals from the external solder balls of the package to the bump pads.

Additional Support

Fast Turn PCB Fabrication

Seek Tech offers Fast Turn PCB Fabrication as an added service. Rooted in traditional PCB manufacturing, we boast strong expertise, crafting nearly all PCB types—single-layer, multi-layer, rigid, flexible.

Our advanced facilities and skilled technicians handle complex designs effortlessly, catering to prototypes and large-scale runs alike.

A key strength is rapid delivery. Optimized processes enable 24-hour turnaround, crucial for meeting tight deadlines and testing new designs. With Seek Tech, you get quality, versatility, and speed in one.