PCB Manufacturing & PCB Assembly

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+86 755-2708-8549

Service Time

Mon-Sat: 8:00-23:00

Rigid PCB Capability

To let you understand our capability quickly.

Item:  Capability: 
Product Types:  1-40L, HDI (5+N+5), Hybrid Lamination, Back Plane, Ultra-thin
Laminates:  FR4, Halogen Free, High TG, Low Loss, High Speed
Board Thickness;  0.08mm-6.0mm, 0.08mm 2L no solder mask, min core 0.05mm
Copper Thickness:  H OZ – 10 OZ 
Largest Finished Size:  580 × 610mm
Drilling: Blind/Buried Hole,Half PTH,Smallest PTH:0.1mm and Biggest PTH:6.5mm 
Line Width/Spacing:  0.03/0.03mm 
Surface Finishing: OSP、HASL、Flash Gold、ENIG、Immersion Tin、Immersion Silver, Flux、Gold Finger(Hard Gold) ,EPEIG 
Aspect Ratio:  20:1 
Outline:  Punching,Routing,V-CUT;Beveled Edge 
Tolerance:  Outline:±0.05mm /NPTH:±0.05mm/PTH:±0.075mm/Hole:±0.075mm/V-CUT:±0.1mm 
Via Treatment:  Tented, Plug, resin fill, copper paste fill, silver paste fill, POFV, VIPPO 
Board Wrap / Twist:  According to IPC-A-600G Standard. :0.75%[max] 
Testing: Impedence Test、Open-short Test、Flying Probe Test、High-Pot Test;